Formation of aluminum electrode UBM on wafer, electroless plating equipment for UBM formation.
Plating chemicals, total proposals for surface treatment processes and equipment. UBM formation for power semiconductors, electroless plating process/plating equipment.
We have newly developed the "TORYZA EL PROCESS," an electroless plating process for forming UBM for power semiconductors that suppresses aluminum electrode delamination and localized corrosion, making it suitable for high-temperature applications. Additionally, leveraging the know-how gained as a surface treatment and plating chemical manufacturer, we have designed and developed the "TORYZA EL SYSTEM," an electroless plating equipment for UBM formation in collaboration with equipment manufacturers. We offer a comprehensive proposal that includes plating chemicals, surface treatment processes, and equipment.
- Company：奥野製薬工業 大阪・放出、東京、名古屋など
- Price：Other
